US 12,334,568 B2
Casing material for power storage device, production method therefor, and power storage device
Daisuke Yasuda, Tokyo (JP); and Takanori Yamashita, Tokyo (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed on Apr. 17, 2024, as Appl. No. 18/637,876.
Application 18/637,876 is a continuation of application No. 17/287,193, granted, now 11,990,629, previously published as PCT/JP2019/041797, filed on Oct. 24, 2019.
Claims priority of application No. 2018-200441 (JP), filed on Oct. 24, 2018.
Prior Publication US 2024/0283061 A1, Aug. 22, 2024
Int. Cl. H01M 50/124 (2021.01); H01G 11/30 (2013.01); H01G 11/82 (2013.01)
CPC H01M 50/1243 (2021.01) [H01G 11/30 (2013.01); H01G 11/82 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A power storage device outer packaging material which comprises a laminate including at least a base material layer, a barrier layer and a heat-sealable resin layer in this order, wherein
the heat-sealable resin layer includes a single layer or multiple layers,
a first heat-sealable resin layer of the heat-sealable resin layer, which forms a surface of the laminate, has a logarithmic decrement ΔE of 0.20 or less at 140° C. in a rigid pendulum measurement, and
the thickness of the first heat-sealable resin layer is 20 μm or more and 60 μm or less.