US 12,334,489 B2
Lthc as charging barrier in info package formation
Yi-Jen Lai, Hsinchu (TW); Chung-Yi Lin, Hsinchu (TW); Hsi-Kuei Cheng, Zhubei (TW); Chen-Shien Chen, Zhubei (TW); and Kuo-Chio Liu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 29, 2024, as Appl. No. 18/425,389.
Application 18/425,389 is a division of application No. 17/874,492, filed on Jul. 27, 2022, granted, now 11,923,353.
Application 16/569,078 is a division of application No. 15/907,409, filed on Feb. 28, 2018, granted, now 10,522,526, issued on Dec. 31, 2019.
Application 17/874,492 is a continuation of application No. 16/569,078, filed on Sep. 12, 2019, granted, now 11,437,361, issued on Sep. 6, 2022.
Claims priority of provisional application 62/538,192, filed on Jul. 28, 2017.
Prior Publication US 2024/0222352 A1, Jul. 4, 2024
Int. Cl. H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/50 (2013.01) [H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/60 (2013.01); H01L 24/02 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02319 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
an encapsulating material;
a through-via extending through the encapsulating material;
a semiconductor die in the encapsulating material;
a Light To Heat Conversion (LTHC) coating material over the encapsulating material and the semiconductor die, the LTHC coating material comprising carbon black particles, wherein the LTHC coating material comprises a first plurality of portions alternating with a second plurality of portions, and wherein a difference in height between a thickness of the first plurality of portions and a thickness of the second plurality of portions is in a range from 0.1 μm to 0.5 μm; and
a first solder region extending through the LTHC coating material.