US 12,334,486 B2
Display device and method of manufacturing the same
In Woo Kim, Asan-si (KR); Chang Woo Kwon, Seoul (KR); Dae Cheol Kim, Hwaseong-si (KR); Jong Hwan Park, Hwaseong-si (KR); Yong Tae Cho, Yongin-si (KR); and Kook Hyun Choi, Asan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Aug. 17, 2022, as Appl. No. 17/889,916.
Claims priority of application No. 10-2022-0008380 (KR), filed on Jan. 20, 2022.
Prior Publication US 2023/0230967 A1, Jul. 20, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC H01L 25/167 (2013.01) [H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H10D 86/0231 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); H01L 24/95 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24991 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/95133 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display device comprising:
a conductive pattern disposed on a substrate;
a via layer disposed on the conductive pattern, comprising a via hole, and exposing the conductive pattern;
a first electrode and a second electrode that are disposed on the via layer and spaced apart from each other;
a first insulating layer disposed on the first electrode and the second electrode;
a bank layer disposed on the first insulating layer and defining an emission area and a subarea;
a light-emitting element disposed on the first insulating layer in the emission area; and
a first connection electrode and a second connection electrode that are disposed on the first insulating layer and the light-emitting element, wherein
the first connection electrode electrically contacts an end of the light-emitting element and the second connection electrode electrically contacts another end of the light-emitting element,
the bank layer comprises a bank extension portion extended to the subarea, and
the bank extension portion overlaps at least a portion of the via hole in a plan view.