US 12,334,468 B2
Solder reflow apparatus
Youngja Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2023, as Appl. No. 18/136,416.
Claims priority of application No. 10-2022-0126177 (KR), filed on Oct. 4, 2022.
Prior Publication US 2024/0113067 A1, Apr. 4, 2024
Int. Cl. B23K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/015 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/75 (2013.01) [B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 1/015 (2013.01); B23K 3/087 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75251 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/7598 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A solder reflow apparatus comprising:
a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate;
a heater configured to heat the heat transfer fluid in the reflow chamber;
a stage arranged in the reflow chamber to support the substrate; and
a jig disposed on the electronic part and fixing the electronic part,
wherein a lower surface of the jig includes a slant surface.