	US 12,334,467 B2
	Copper bonding wire
Tomohiro Uno, Tokyo (JP); Tetsuya Oyamada, Tokyo (JP); Daizo Oda, Saitama (JP); Kota Shimomura, Saitama (JP); and Tadashi Yamaguchi, Saitama (JP)
Assigned to NIPPON MICROMETAL CORPORATION, Saitama (JP); and NIPPON STEEL Chemical & Material Co., Ltd., Tokyo (JP)
Appl. No. 17/798,833
Filed by NIPPON MICROMETAL CORPORATION, Saitama (JP); and NIPPON STEEL Chemical & Material Co., Ltd., Tokyo (JP)
PCT Filed Feb. 19, 2021, PCT No. PCT/JP2021/006431 § 371(c)(1), (2) Date Aug. 10, 2022, PCT Pub. No. WO2021/167083, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 2020-028560 (JP), filed on Feb. 21, 2020.
Prior Publication US 2023/0105851 A1, Apr. 6, 2023
Int. Cl. H01L 23/00 (2006.01); G01N 23/2273 (2018.01)

CPC H01L 24/45 (2013.01) [G01N 23/2273 (2013.01); H01L 2224/45005 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/45173 (2013.01); H01L 2224/45187 (2013.01); H01L 2924/37002 (2013.01)]

7 Claims

1. A copper bonding wire a surface of which comprising: Cu, Cu₂O, CuO, and Cu(OH)₂,

wherein a sum of percentages of Cu, Cu₂O, CuO and Cu(OH)₂on the surface of the copper bonding wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, and

wherein a ratio Cu[II]/Cu[I], which is a ratio of a total percentage of CuO and Cu(OH)₂(Cu[II]) corresponding to bivalent Cu to a percentage of Cu₂O (Cu[I]) corresponding to monovalent Cu, falls within a range from 0.8 to 12.