US 12,334,465 B2
Semiconductor package and method of forming same
Li-Hsien Huang, Zhubei (TW); Yao-Chun Chuang, Hsinchu (TW); SyuFong Li, Taoyuan (TW); Ching-Pin Lin, Hsinchu (TW); and Jun He, Zhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 10, 2024, as Appl. No. 18/631,900.
Application 18/631,900 is a division of application No. 17/678,774, filed on Feb. 23, 2022, granted, now 11,984,422.
Claims priority of provisional application 63/230,117, filed on Aug. 6, 2021.
Prior Publication US 2024/0258263 A1, Aug. 1, 2024
Int. Cl. H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01)
CPC H01L 24/27 (2013.01) [H01L 21/6835 (2013.01); H01L 22/14 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/30 (2013.01); H01L 2224/0384 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/275 (2013.01); H01L 2224/30181 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor substrate disposed over a package component;
an interconnect structure disposed over the semiconductor substrate, the interconnect structure electrically connected to integrated circuit devices at a surface of the semiconductor substrate;
a first aluminum pad disposed over the semiconductor substrate and electrically connected to the interconnect structure, the first aluminum pad comprising:
a top major surface opposite the semiconductor substrate;
a first recess in the top major surface extending toward the semiconductor substrate; and
a protrusion from the top major surface extending away from the semiconductor substrate;
a second aluminum pad disposed over the semiconductor substrate and electrically connected to the interconnect structure; and
a first dielectric bond layer disposed over and around the first aluminum pad and the second aluminum pad.