US 12,334,464 B2
Encapsulated package including device dies connected via interconnect die
Kuo-Chiang Ting, Hsinchu (TW); Chi-Hsi Wu, Hsinchu (TW); Shang-Yun Hou, Jubei (TW); Tu-Hao Yu, Hsinchu (TW); Chia-Hao Hsu, Hsinchu (TW); and Ting-Yu Yeh, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 8, 2024, as Appl. No. 18/629,641.
Application 18/629,641 is a continuation of application No. 18/068,064, filed on Dec. 19, 2022, granted, now 11,978,714.
Application 18/068,064 is a continuation of application No. 17/121,353, filed on Dec. 14, 2020, granted, now 11,532,585, issued on Dec. 20, 2022.
Application 17/121,353 is a continuation of application No. 15/813,538, filed on Nov. 15, 2017, granted, now 10,867,954, issued on Oct. 15, 2020.
Prior Publication US 2024/0258261 A1, Aug. 1, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 24/24 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a plurality of redistribution lines over a carrier;
placing an interconnect die over the plurality of redistribution lines, wherein the interconnect die is adhered to a first redistribution line and a second redistribution line of the plurality of redistribution lines through a die-attach film, wherein the first redistribution line and the second redistribution line are separated from each other by a region;
forming a through-via over the plurality of redistribution lines;
encapsulating the interconnect die and the through-via in an encapsulant, wherein during the encapsulating, the region is either filled with the encapsulant, or is left as an air gap;
bonding a first device die and a second device die to the interconnect die; and
removing the carrier.