US 12,334,458 B2
Package with pad having open notch
Adrian Lis, Regensburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Sep. 28, 2021, as Appl. No. 17/487,682.
Claims priority of application No. 10 2020 125 371.0 (DE), filed on Sep. 29, 2020.
Prior Publication US 2022/0102299 A1, Mar. 31, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 21/50 (2013.01); H01L 23/367 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A package which comprises:
an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch; and
a spacer body mounted on the first pad and bridging at least part of the open notch,
wherein the electronic component has an electrically conductive second pad on the first main surface;
wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad and outside of the open notch of the first pad;
wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape;
wherein the first main surface has an electrically insulating region at the open notch of the first pad; and
wherein the spacer body bridges the open notch of the first pad without direct physical contact with the electrically insulating region.