US 12,334,457 B2
Integrated fan-out package
Chuei-Tang Wang, Taichung (TW); Tzu-Chun Tang, Kaohsiung (TW); Chieh-Yen Chen, Taipei (TW); and Che-Wei Hsu, Kaohsiung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 1, 2024, as Appl. No. 18/430,568.
Application 18/430,568 is a division of application No. 17/740,373, filed on May 10, 2022, granted, now 11,929,333.
Application 17/740,373 is a continuation of application No. 16/886,709, filed on May 28, 2020, granted, now 11,348,886, issued on May 31, 2022.
Application 16/886,709 is a continuation of application No. 16/198,857, filed on Nov. 22, 2018, granted, now 10,672,728, issued on Jun. 2, 2020.
Claims priority of provisional application 62/737,880, filed on Sep. 27, 2018.
Prior Publication US 2024/0213186 A1, Jun. 27, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/14 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 31/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 13/10 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 13/10 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated fan-out (InFO) package, comprising:
a die having an active surface and a rear surface opposite to the active surface;
an encapsulant laterally encapsulating the die; and
a horn antenna electrically connected to the die, wherein the horn antenna comprises a top wall and a bottom wall respectively located on two opposite sides of the die and the encapsulant, a portion of the top wall is located within a span of the active surface of the die, and a portion of the bottom wall is located within a span of the rear surface of the die.