US 12,334,456 B2
Electronic package and manufacturing method thereof
Chung-Yu Ke, Taichung (TW); and Liang-Pin Chen, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jul. 6, 2022, as Appl. No. 17/858,905.
Claims priority of application No. 111119694 (TW), filed on May 26, 2022.
Prior Publication US 2023/0402409 A1, Dec. 14, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/66 (2013.01) [H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01Q 1/2283 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/2027 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a package module internally configured with at least one electronic element and a plurality of feeding lines electrically connected to the at least one electronic element, wherein the plurality of feeding lines are defined with a first antenna layer and a second antenna layer;
a heat sink disposed on a portion of a surface of the package module and extending into the package module to thermally connect the at least one electronic element;
first antenna bodies disposed on portions of the surface of the package module corresponding to a position of the first antenna layer, wherein the first antenna bodies and the first antenna layer are kept at a distance, such that the first antenna bodies and the first antenna layer form a first antenna structure;
an insulating spacer disposed on a portion of the surface of the package module; and
second antenna bodies disposed on the insulating spacer corresponding to a position of the second antenna layer, wherein the second antenna bodies and the second antenna layer are located on opposite sides of the insulating spacer, such that the second antenna bodies and the second antenna layer form a second antenna structure.