US 12,334,455 B2
Semiconductor package with integrated capacitors
Michael Su, Austin, TX (US); Michael Alfano, Austin, TX (US); and Siddharth Ravichandran, Austin, TX (US)
Assigned to Chipletz, Inc., Spicewood, TX (US)
Filed by Chipletz, Inc., Spicewood, TX (US)
Filed on Jul. 15, 2024, as Appl. No. 18/773,010.
Application 18/773,010 is a division of application No. 17/692,587, filed on Mar. 11, 2022.
Prior Publication US 2025/0015019 A1, Jan. 9, 2025
Int. Cl. H10D 1/00 (2025.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2023.01); H10D 1/68 (2025.01); H01L 23/00 (2006.01)
CPC H01L 23/642 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 25/16 (2013.01); H10D 1/042 (2025.01); H10D 1/043 (2025.01); H10D 1/716 (2025.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01)] 13 Claims
OG exemplary drawing
 
2. A package comprising:
a substrate core having a top surface and a bottom surface;
a thin-film capacitor having a top surface and a bottom surface, the thin-film capacitor forming at least a portion of the substrate core with the top surface of the thin-film capacitor substantially coplanar with the top surface of the substrate core and the bottom surface of the thin-film capacitor substantially coplanar with the bottom surface of the substrate core;
a top redistribution layer formed on the top surface of the substrate core, the top distribution layer having a top surface and a bottom surface and being adapted to facilitate electrical connection to the top surface of the thin-film capacitor;
a bottom redistribution layer formed on the bottom surface of the substrate core, the bottom distribution layer having a top surface and a bottom surface and being adapted to facilitate electrical connection to the bottom surface of the thin-film capacitor;
a first level interconnect formed on the top surface of the top redistribution layer, and adapted to facilitate connection to the top surface of the thin-film capacitor via the top redistribution layer;
a second level interconnect formed on the bottom surface of the bottom redistribution layer, and adapted to facilitate electrical connection to the bottom surface of the thin-film capacitor via the bottom redistribution layer; and
an electrical connection extending vertically through the thin-film capacitor;
wherein the thin-film capacitor is further characterized as comprising:
an insulator;
a conductive core within the insulator;
at least one first terminal forming one of either a cathode or anode connected to the conductive core through the insulator;
a current collector separated from the conductive core by a dielectric; and
at least one second terminal forming the other of either the cathode or anode connected to the current collector.