US 12,334,452 B2
Electronic package and manufacturing method thereof
Chao-Chiang Pu, Taichung (TW); Chi-Ching Ho, Taichung (TW); Yi-Min Fu, Taichung (TW); Yu-Po Wang, Taichung (TW); and Fang-Lin Tsai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Sep. 22, 2022, as Appl. No. 17/950,914.
Claims priority of application No. 111127968 (TW), filed on Jul. 26, 2022.
Prior Publication US 2024/0038685 A1, Feb. 1, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4817 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/37001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a cladding layer having a first surface and a second surface opposing the first surface;
an electronic structure embedded in the cladding layer;
a plurality of conductive pillars embedded in the cladding layer;
at least one reinforcing member bonded to the cladding layer;
a circuit structure formed on the first surface of the cladding layer and electrically connected to the plurality of conductive pillars and the electronic structure, wherein the circuit structure is free from being electrically connected to the reinforcing member; and
a plurality of electronic elements disposed on and electrically connected to the circuit structure, wherein the electronic structure acts as a bridge element to electrically bridge at least two of the plurality of electronic elements via the circuit structure.