US 12,334,450 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Jin Seong Kim, Chandler, AZ (US); Yeong Beom Ko, Taichung (TW); Kwang Seok Oh, Incheon (KR); Jo Hyun Bae, Incheon (KR); Sung Woo Lim, Seoul (KR); Yun Ah Kim, Gyeonggi-do (KR); Yong Jae Ko, Gwangju (KR); and Ji Chang Lee, Gwangju (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Dec. 20, 2023, as Appl. No. 18/391,075.
Application 18/391,075 is a continuation of application No. 17/510,528, filed on Oct. 26, 2021, granted, now 11,854,991.
Application 17/510,528 is a continuation of application No. 16/703,240, filed on Dec. 4, 2019, granted, now 11,158,582, issued on Oct. 26, 2021.
Prior Publication US 2024/0194610 A1, Jun. 13, 2024
Int. Cl. H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate having a top side, a bottom side, a dielectric structure, and a conductive structure;
a first electronic component on the top side of the substrate;
a second electronic component on the bottom side of the substrate;
an encapsulant structure comprising an encapsulant bottom portion on the bottom side of the substrate and encapsulating the second electronic component;
a conductive pillar in the encapsulant bottom portion, the conductive pillar including a top side oriented toward the substrate, a bottom side oriented away from the substrate, and a linear sidewall located between the top side and the bottom side; and
an internal interconnect coupling the conductive pillar to the conductive structure of the substrate;
wherein the internal interconnect comprises solder and the conductive pillar comprises copper; and
wherein a height of the conductive pillar is less than or equal to a height of the encapsulant bottom portion, and wherein the conductive pillar electrically connects the conductive structure of the substrate to a circuit external to the encapsulant structure.