US 12,334,419 B2
Lead frame and electronic component
Kazuma Yamawaki, Tokyo (JP); and Shuhei Miyazaki, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jul. 5, 2022, as Appl. No. 17/857,838.
Claims priority of application No. 2021-134659 (JP), filed on Aug. 20, 2021.
Prior Publication US 2023/0056523 A1, Feb. 23, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49548 (2013.01) [H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A lead frame for an electronic component, comprising:
a die pad;
a plurality of leads;
at least one support lead; and
a frame member configured to surround the die pad, the plurality of leads, and the at least one support lead, wherein:
the frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction;
the plurality of leads include a plurality of specific leads arranged along the first connection bar;
the plurality of specific leads are each connected to the first connection bar;
at least one of the specific leads is connected to the second connection bar via the at least one support lead; and
a cross-sectional second-order moment of a first cross section of the at least one support lead perpendicular to the first direction, around an axis parallel to the second direction is equal to or more than a cross-sectional second-order moment of a second cross section of the at least one support lead perpendicular to the second direction, around an axis parallel to the first direction, the second cross section being substantially perpendicular to the first cross section.