US 12,334,418 B2
Semiconductor module with improved inspectability of stacked semiconductor elements
Syuhei Miyachi, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Mar. 30, 2022, as Appl. No. 17/657,287.
Application 17/657,287 is a continuation of application No. PCT/JP2020/037025, filed on Sep. 29, 2020.
Claims priority of application No. 2019-182499 (JP), filed on Oct. 2, 2019.
Prior Publication US 2022/0223502 A1, Jul. 14, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 23/293 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 25/074 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
two semiconductor elements having a substantially rectangular shape with adjacent sides being unequal when viewed from above in a vertical direction and stacked in the vertical direction to overlap at least a part of the substantially rectangular shape;
a conductive member stacked on an upper surface side or a lower surface side of the two semiconductor elements and electrically connected to at least one of the two semiconductor elements; and
a resin mold integrally sealing the two semiconductor elements and the conductive member, wherein:
a lower semiconductor element of the two semiconductor elements arranged on a lower side is arranged to have at least observable positions of both ends of two sides on the substantially rectangular shape substantially orthogonal to each other when the semiconductor module is viewed from above in the vertical direction without arranging the resin mold; and
the two semiconductor elements are stacked to have a direction rotated by approximately 90 degrees with respect to each other in the vertical direction.