US 12,334,417 B2
Leaded semiconductor device package having leads with different widths
Masamitsu Matsuura, Beppu (JP)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Aug. 31, 2021, as Appl. No. 17/462,067.
Prior Publication US 2023/0068748 A1, Mar. 2, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/482 (2006.01); H05K 7/10 (2006.01)
CPC H01L 23/4951 (2013.01) [H01L 23/4824 (2013.01); H01L 23/4952 (2013.01); H05K 7/1046 (2013.01)] 28 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a package substrate including a die pad and including leads spaced from the die pad surface;
a semiconductor die mounted to the package substrate on the die pad, the semiconductor die having bond pads on an active surface;
electrical connections coupling the bond pads of the semiconductor die to the leads;
mold compound covering a portion of the package substrate, the semiconductor die, and the electrical connections, with the leads extending through the mold compound and having end portions exposed from the mold compound; and
the end portions exposed from the mold compound including a first portion with a first width and extending with the first width from the mold compound to a second portion having a second width that is greater than the first width, wherein a distal end of the leads includes the second width.