US 12,334,413 B2
System in package with flip chip die over multi-layer heatsink stanchion
Kelly M. Lear, Longwood, FL (US); Jeffrey Miller, Allen, TX (US); Mihir Roy, Sachse, TX (US); and Christine Blair, Lewisville, TX (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Filed by Qorvo US, Inc., Greensboro, NC (US)
Filed on Feb. 5, 2024, as Appl. No. 18/432,852.
Application 18/432,852 is a continuation of application No. 17/538,583, filed on Nov. 30, 2021, granted, now 11,942,391.
Prior Publication US 2024/0178096 A1, May 30, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/492 (2006.01)
CPC H01L 23/3677 (2013.01) [H01L 23/481 (2013.01); H01L 23/4924 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a chiplet having a first die and a substrate that includes a plurality of dielectric layers, at least one heatsink stanchion, and at least one via structure, wherein:
the at least one heatsink stanchion includes a plurality of heatsink metal plates and a plurality of heatsink metal bars, wherein the plurality of heatsink metal bars is vertically alternated with the plurality of heatsink metal plates;
the at least one via structure includes a plurality of via metal plates and a plurality of via metal bars, wherein the plurality of via metal bars is vertically alternated with the plurality of via metal plates;
the plurality of heatsink metal bars is configured in a layered-cake shape, such that horizontal dimensions of the plurality of heatsink metal bars increase from top to bottom;
at least one of the plurality of heatsink metal bars vertically and completely protrudes beyond the plurality of dielectric layers, and at least another one of the plurality of heatsink metal bars extends through one of the plurality of dielectric layers, wherein each of the plurality of heatsink metal bars is formed of a metal or a metallic alloy;
at least one of the plurality of heatsink metal bars in the at least one heatsink stanchion is more than ten times larger than one of the plurality of via metal bars in the at least one via structure in a horizontal plane; and
the first die is deposed over the substrate and connected to the at least one heatsink stanchion and the at least one via structure, such that heat generated by the first die is eligible to be dissipated by the at least one heatsink stanchion within the substrate, and signals are eligible to be transmitted to and received from the first die through the at least one via structure.