US 12,334,412 B2
Electronic package and method of forming the same
Chang-Lin Yeh, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jan. 5, 2022, as Appl. No. 17/569,446.
Prior Publication US 2023/0215775 A1, Jul. 6, 2023
Int. Cl. H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/3677 (2013.01) [H01L 23/3736 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an electronic component;
a thermal conductive structure above the electronic component; and
a first intermediate layer between the electronic component and the thermal conductive structure,
wherein the first intermediate layer comprises a metal particle exposed from a surface of the first intermediate layer and contacting the thermal conductive structure,
wherein the thermal conductive structure comprises a first pore defined by a first inner sidewall of the thermal conductive structure, and the metal particle contacts a portion of the first inner sidewall; and
wherein the metal particle is partially embedded in the first intermediate layer and partially embedded in the thermal conductive structure.
 
6. An electronic package, comprising:
an electronic component;
a thermal conductive element above the electronic component; and
an intermediate layer between the electronic component and the thermal conductive element,
wherein an upper surface of the intermediate layer comprises a recessed portion and an upper portion, the thermal conductive element extends into the recessed portion of the upper surface of the intermediate layer, and the thermal conductive element exposes a portion of the upper portion; and
wherein the thermal conductive element comprises a stepped portion partially covering the recessed portion and the upper portion of the upper surface of the intermediate layer.