US 12,334,409 B2
Semiconductor module
Yasufumi Hara, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed by FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed on Mar. 22, 2022, as Appl. No. 17/700,532.
Claims priority of application No. 2021-085779 (JP), filed on May 21, 2021.
Prior Publication US 2022/0375810 A1, Nov. 24, 2022
Int. Cl. H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/473 (2006.01)
CPC H01L 23/3171 (2013.01) [H01L 23/053 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 23/473 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/351 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A semiconductor module, comprising:
a semiconductor chip including a semiconductor substrate and a metal electrode provided above the semiconductor substrate;
a protective film provided above the metal electrode;
a plated layer provided above the metal electrode, having at least a part being in a height identical to the protective film;
a solder layer provided above the plated layer; and
a lead frame provided above the solder layer,
wherein the plated layer is provided in a range that is not in contact with the protective film and does not overlap with the protective film in a top view.