US 12,334,407 B2
Semiconductor device and method of manufacturing semiconductor device
Takuya Shiratsuru, Tokyo (JP); Shoji Saito, Tokyo (JP); and Katsuhiko Kondo, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/789,100
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Feb. 7, 2020, PCT No. PCT/JP2020/004722
§ 371(c)(1), (2) Date Jun. 24, 2022,
PCT Pub. No. WO2021/157045, PCT Pub. Date Aug. 12, 2021.
Prior Publication US 2022/0359325 A1, Nov. 10, 2022
Int. Cl. H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 21/56 (2013.01); H01L 23/492 (2013.01); H01L 23/49541 (2013.01); H01L 23/562 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a base plate;
an insulating substrate fixed on the base plate and having a conductive pattern on an upper surface;
a semiconductor element mounted on the conductive pattern;
a case fixed to the base plate and surrounding the insulating substrate and the semiconductor element; and
a frame having one end portion provided in the case and another end portion connected to a connection surface of the conductive pattern or the semiconductor element, wherein
the frame includes a first frame portion extending in a direction parallel to the connection surface to be connected to the connection surface and a second frame portion connecting the case and the first frame portion,
the first frame portion is divided into a plurality of divided portions formed in a tip end portion of the first frame portion,
at least one divided portion in the plurality of divided portions in the first frame portion is an elastic portion which can be elastically deformed from a first state where the tip end portion is inclined downward toward the connection surface to a second state where the tip end portion extends in the direction parallel to the connection surface, and
the elastic portion is connected to the connection surface while being elastically deformed from the first state to the second state.