US 12,334,405 B2
Electronic devices including vent openings and associated methods
Michael Stadler, Munich (DE); and Thomas Bemmerl, Schwandorf (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 20, 2023, as Appl. No. 18/211,898.
Claims priority of application No. 10 2022 116 039.4 (DE), filed on Jun. 28, 2022.
Prior Publication US 2023/0420317 A1, Dec. 28, 2023
Int. Cl. H01L 23/16 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/16 (2013.01) [B23K 1/0016 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/315 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 24/81 (2013.01); H05K 3/3431 (2013.01); B23K 2101/42 (2018.08); H01L 2021/60007 (2013.01); H01L 2021/60022 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/3511 (2013.01); H05K 2203/1178 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a solderable surface;
at least one surface opening arranged in the solderable surface;
an encapsulation material encapsulating at least one electronic component of the electronic device; and
at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.