US 12,334,402 B2
Fabrication of thin-film encapsulation layer for light-emitting device
Eliyahu Vronsky, Los Altos, CA (US); and Nahid Harjee, Sunnyvale, CA (US)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on Dec. 14, 2022, as Appl. No. 18/065,797.
Application 16/546,006 is a division of application No. 15/802,325, filed on Nov. 2, 2017, granted, now 10,811,324, issued on Oct. 20, 2020.
Application 18/065,797 is a continuation of application No. 17/305,963, filed on Jul. 19, 2021, granted, now 11,551,982.
Application 17/305,963 is a continuation of application No. 16/546,006, filed on Aug. 20, 2019, granted, now 11,088,035, issued on Aug. 10, 2021.
Application 15/802,325 is a continuation of application No. 15/416,931, filed on Jan. 26, 2017, granted, now 10,586,742, issued on Mar. 10, 2020.
Application 15/416,931 is a continuation of application No. 15/279,261, filed on Sep. 28, 2016, granted, now 9,806,298, issued on Oct. 31, 2017.
Application 15/279,261 is a continuation of application No. 14/627,186, filed on Feb. 20, 2015, granted, now 9,496,519, issued on Nov. 15, 2016.
Application 14/627,186 is a continuation of application No. 14/458,005, filed on Aug. 12, 2014, granted, now 8,995,022, issued on Mar. 31, 2015.
Claims priority of provisional application 62/019,076, filed on Jun. 30, 2014.
Claims priority of provisional application 62/005,044, filed on May 30, 2014.
Claims priority of provisional application 61/977,939, filed on Apr. 10, 2014.
Claims priority of provisional application 61/915,149, filed on Dec. 12, 2013.
Prior Publication US 2023/0147887 A1, May 11, 2023
Int. Cl. H04N 1/405 (2006.01); B05C 11/10 (2006.01); B41J 2/01 (2006.01); B41J 2/045 (2006.01); B41J 2/205 (2006.01); B41J 2/21 (2006.01); B41J 3/407 (2006.01); B41M 3/00 (2006.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H10F 19/80 (2025.01); H10F 77/50 (2025.01); H10H 20/852 (2025.01); H10H 20/853 (2025.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 71/00 (2023.01); H10K 71/13 (2023.01); H10K 71/70 (2023.01); H10H 20/01 (2025.01); H10H 20/854 (2025.01); H10K 59/12 (2023.01); H10K 59/80 (2023.01)
CPC H01L 22/12 (2013.01) [B05C 11/10 (2013.01); B41J 2/01 (2013.01); B41J 2/04581 (2013.01); B41J 2/2054 (2013.01); B41J 2/21 (2013.01); B41J 3/407 (2013.01); B41M 3/00 (2013.01); B41M 5/0047 (2013.01); B41M 7/0081 (2013.01); H01L 21/02288 (2013.01); H01L 21/67126 (2013.01); H01L 22/26 (2013.01); H04N 1/405 (2013.01); H10F 19/80 (2025.01); H10F 77/50 (2025.01); H10H 20/852 (2025.01); H10H 20/853 (2025.01); H10K 50/84 (2023.02); H10K 50/844 (2023.02); H10K 71/00 (2023.02); H10K 71/135 (2023.02); H10K 71/70 (2023.02); B41M 7/009 (2013.01); H10H 20/0362 (2025.01); H10H 20/854 (2025.01); H10K 50/8445 (2023.02); H10K 59/1201 (2023.02); H10K 59/8731 (2023.02); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a layer of an electronic device, wherein the layer is to span an area of a substrate, the area having at least one lateral edge, the method comprising:
receiving a value representing a desired thickness of the layer;
using an ink jet printer to deposit droplets of liquid, the droplets to coalesce to form a continuous liquid coat within the area; and
using a curing mechanism to cure the continuous liquid coat to form the layer;
wherein using the ink jet printer to deposit the droplets of liquid comprises deposing droplets at a first density of droplets at the at least one lateral edge to form a frame for the layer, and
depositing droplets within the frame at a second density of droplets different from the first density of droplets, wherein the second density of droplets is based on the value and on a correction image representing a topography of the area.