US 12,334,396 B2
Unit specific variable or adaptive metal fill and system and method for the same
David Ryan Bartling, Mesa, AZ (US); Craig Bishop, Scottsdale, AZ (US); and Timothy L. Olson, Phoenix, AZ (US)
Assigned to Deca Technologies USA, Inc., Tempe, AZ (US)
Filed by Deca Technologies USA, Inc., Tempe, AZ (US)
Filed on Oct. 16, 2023, as Appl. No. 18/487,957.
Application 18/487,957 is a continuation of application No. 17/885,511, filed on Aug. 10, 2022, granted, now 11,791,207.
Claims priority of provisional application 63/232,949, filed on Aug. 13, 2021.
Prior Publication US 2024/0222193 A1, Jul. 4, 2024
Int. Cl. H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01)
CPC H01L 21/76877 (2013.01) [H01L 23/3178 (2013.01); H01L 23/53271 (2013.01); H10D 84/0149 (2025.01); H10D 84/038 (2025.01)] 20 Claims
OG exemplary drawing
 
14. A method of forming an electronic product, comprising:
providing a first shift region in which to determine a first displacement;
forming a unique electrically conductive structure extending to the first shift region to account for the first displacement; and
forming a unique variable metal fill adjacent the first shift region, wherein the unique variable metal fill comprises one or more of a power plane, a ground plane, or a via.