US 12,334,384 B2
Methods and apparatus for minimizing substrate backside damage
Liangfa Hu, San Jose, CA (US); Abdul Aziz Khaja, San Jose, CA (US); Sarah Michelle Bobek, Sunnyvale, CA (US); Prashant Kumar Kulshreshtha, San Jose, CA (US); and Yoichi Suzuki, Funabashi (JP)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 14, 2023, as Appl. No. 18/233,751.
Application 18/233,751 is a continuation of application No. 16/855,206, filed on Apr. 22, 2020, granted, now 11,756,819.
Claims priority of provisional application 62/848,935, filed on May 16, 2019.
Prior Publication US 2023/0386883 A1, Nov. 30, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/26 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/26 (2013.01); H01L 21/68735 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate support, comprising:
a body formed of a material comprising a grain size between about 1 μm and about 4 μm;
an electrode disposed within the body;
a temperature control device disposed within the body; and
a plurality of substrate supporting features formed on a substrate supporting region of the substrate support, the plurality of substrate supporting features comprising between about 75 and about 100 substrate support features, each of the substrate supporting features having a substrate supporting surface and a rounded edge, wherein a distance between each substrate supporting feature is between about 0.7 mm and 3 mm, and wherein each of the plurality of substrate supporting features have a surface roughness between about 2 Ra and about 3 Ra.