US 12,334,380 B2
Boat transfer method and heat treatment apparatus
Shingo Hishiya, Yamanashi (JP); Hiroaki Ikegawa, Yamanashi (JP); Volker Hemel, Dresden (DE); Bernhard Zobel, Dresden (DE); and Sung Duk Son, Gyeonggi-do (KR)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Oct. 4, 2021, as Appl. No. 17/449,848.
Claims priority of application No. 2020-175464 (JP), filed on Oct. 19, 2020.
Prior Publication US 2022/0122867 A1, Apr. 21, 2022
Int. Cl. H01L 21/677 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67751 (2013.01) [C23C 16/4402 (2013.01); C23C 16/4408 (2013.01); C23C 16/455 (2013.01); H01L 21/67109 (2013.01); H01L 21/67303 (2013.01); H01L 21/67739 (2013.01); H01L 21/67757 (2013.01); H01L 21/67098 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A heat treatment method comprising:
preparing a boat holding a substrate, a metal film being formed on a surface of the substrate,
supplying a reducing gas into a processing chamber,
transferring the boat holding the substrate with the metal film formed thereon into the processing chamber in a state in which the reducing gas is present within the processing chamber, and
forming a polysilicon film on the metal film of the substrate held by the boat transferred into the processing chamber,
wherein the reducing gas is a forming gas of 4% hydrogen and 96% nitrogen.