US 12,334,376 B2
Substrate transfer systems and methods of use thereof
Alex Berger, Palo Alto, CA (US); Jeffrey Hudgens, San Francisco, CA (US); and Eric Englhardt, Palo Alto, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 7, 2023, as Appl. No. 18/243,433.
Application 18/243,433 is a continuation of application No. 17/370,802, filed on Jul. 8, 2021, granted, now 11,784,074.
Application 17/370,802 is a continuation of application No. 16/825,450, filed on Mar. 20, 2020, granted, now 11,527,424, issued on Dec. 13, 2022.
Prior Publication US 2024/0071796 A1, Feb. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/677 (2006.01); B25J 11/00 (2006.01); B65G 54/02 (2006.01)
CPC H01L 21/67709 (2013.01) [B25J 11/0095 (2013.01); B65G 54/02 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device processing system, comprising:
a transfer chamber, comprising:
a first magnetic levitation track disposed within the transfer chamber, wherein the first magnetic levitation track has a face-up orientation configured to generate a first magnetic field above the first magnetic levitation track,
a second magnetic levitation track disposed within the transfer chamber spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has a face-down orientation configured to generate a second magnetic field below the second magnetic levitation track,
at least one assembly configured to move one or more substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, and a plurality of ports, wherein the at least one assembly is positioned along the first magnetic levitation track; and
a plurality of process chambers, each process chamber in fluid communication with the transfer chamber via a respective port of the plurality of ports.