US 12,334,374 B2
Abnormality detecting apparatus, semiconductor manufacturing apparatus, and abnormality detecting method
Yuka Nakasato, Yamanashi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 22, 2021, as Appl. No. 17/354,158.
Claims priority of application No. 2020-113510 (JP), filed on Jun. 30, 2020.
Prior Publication US 2021/0407835 A1, Dec. 30, 2021
Int. Cl. H01L 21/67 (2006.01); G05B 23/02 (2006.01)
CPC H01L 21/67288 (2013.01) [G05B 23/0205 (2013.01); H01L 21/67253 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An abnormality detecting apparatus for a semiconductor manufacturing apparatus comprising:
a monitor for obtaining data from the semiconductor manufacturing apparatus, from at least one group of a plurality of correlated sensors, the at least one group including:
a first output sensor, for detecting an output of a pipe heater, in communication with a supply pipe of the pipe heater, the supply pipe through which gas is supplied into a processing container, wherein the supply pipe includes a first supply pipe attached to the pipe heater and a second supply pipe connected to other pipe heaters in the semiconductor manufacturing apparatus, wherein the first output sensor is in communication with the first supply pipe;
second output sensors in communication with an exhaust pipe, the second output sensors attached to the exhaust pipe that exhausts the processing container;
or,
opening degree sensors, in communication with a pressure control valve of outlets of the processing container, for detecting the degree that the pressure control valve is opened, wherein the pressure control valve is provided in the exhaust pipe;
a controller configured to 1) generate correlation data from data received from the at least one group of the correlated sensors, the correlation data comprising point data from each of the correlated sensors comprising a value and a time, the time associated with a predetermined time period of a sequence of one or more predetermined time periods, and 2) send the generated correlation data to a storage unit;
a data processor configured to: 1) obtain the correlation data for the predetermined time period, which is a last predetermined time period of the sequence of predetermined time periods, from the storage unit, and 2) determine whether the point data of the correlation data, which was obtained, includes at least a predetermined number of point data; and
a calculator configured to, when the point data of the correlation data, which was obtained, includes at least a predetermined number of point data: 1) arrange the correlation data and fit a regression line to the arranged correlation data, and 2) calculate a slope of the regression line of the correlation data;
wherein the controller is configured to determine an abnormality of the semiconductor manufacturing apparatus based on the slope of the regression line, and to signal when the abnormality is determined.