| CPC H01L 21/67126 (2013.01) [H01L 21/02101 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67109 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/67393 (2013.01); H01L 21/68721 (2013.01); H01L 21/68742 (2013.01)] | 18 Claims |

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1. A substrate treating method using a substrate treating apparatus having a first body and a second body coupled together to form a treating space for treating a substrate, the substrate treating method comprising:
an open step for opening the treating space by adjusting a relative position of the first body and the second body;
a substrate introducing step for introducing the substrate to an opened treating space;
a closing step for closing the treating space by adjusting the relative position of the first body and the second body; and
a process treating step for treating the substrate by supplying a fluid to the treating space, and
wherein at the process treating step,
a pressure of the treating space is formed at a high pressure higher than a normal pressure by a fluid supplied to the treating space, a sealing member positioned within a sealing groove formed at the first body is modified to closely contact the second body by a pressure of the treating space, and a gap between the first body and the second body is sealed by a modified sealing member, and
wherein
the sealing member includes a concave portion facing the treating space, and
the pressure of the treating space modifies the concave portion to open away from the treating space.
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