US 12,334,368 B2
Liquid delivering system for wafer cleaning equipment
Yilin Shen, Shanghai (CN); Xinlai Chen, Shanghai (CN); Dawei Liu, Shanghai (CN); Jie Wang, Shanghai (CN); Zhengkai Lu, Shanghai (CN); Ming Xu, Shanghai (CN); Panpan Li, Shanghai (CN); Fangyi Lv, Shanghai (CN); and Chuanlong Liu, Shanghai (CN)
Assigned to PNC PROCESS SYSTEMS CO., LTD., Shanghai (CN); and ULTRON SEMICONDUCTOR (SHANGHAI) CO., LTD., Shanghai (CN)
Filed by PNC PROCESS SYSTEMS CO., LTD., Shanghai (CN); and ULTRON SEMICONDUCTOR (SHANGHAI) CO., LTD., Shanghai (CN)
Filed on Jan. 16, 2025, as Appl. No. 19/023,785.
Application 19/023,785 is a continuation of application No. PCT/CN2023/106072, filed on Jul. 6, 2023.
Claims priority of application No. 202211617079.3 (CN), filed on Dec. 15, 2022.
Prior Publication US 2025/0157832 A1, May 15, 2025
Int. Cl. H01L 21/00 (2006.01); B01F 23/40 (2022.01); B01F 23/45 (2022.01); B01F 25/4314 (2022.01); B01F 35/21 (2022.01); B01F 35/22 (2022.01); B01F 35/221 (2022.01); B01F 35/60 (2022.01); B01F 35/92 (2022.01); H01L 21/67 (2006.01); B01F 35/90 (2022.01); B01F 101/58 (2022.01)
CPC H01L 21/67057 (2013.01) [B01F 23/45 (2022.01); B01F 23/48 (2022.01); B01F 23/49 (2022.01); B01F 25/43141 (2022.01); B01F 35/2113 (2022.01); B01F 35/2115 (2022.01); B01F 35/2132 (2022.01); B01F 35/2202 (2022.01); B01F 35/2217 (2022.01); B01F 35/602 (2022.01); B01F 35/92 (2022.01); B01F 2035/98 (2022.01); B01F 2035/99 (2022.01); B01F 2101/58 (2022.01)] 7 Claims
OG exemplary drawing
 
1. A liquid delivering system for wafer cleaning equipment comprising an acid scouring tank, a sulfuric acid supplying source and a hydrogen peroxide supplying source, characterized in that the system further comprises a first mixing device, a second mixing device, a feedback-control panel, a third mixing device and a cooling circulation device;
said first mixing device and said second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside said mixing duct and a heater wrapped around said mixing duct;
two principal inlets of said first mixing device lead to said sulfuric acid supplying source and said hydrogen peroxide supplying source through a principal sulfuric acid pipe and a principal hydrogen peroxide pipe, respectively; one principal inlet of said second mixing device leads to one principal outlet of said first mixing device; two ancillary inlets of said second mixing device lead to said sulfuric acid supplying source and said hydrogen peroxide supplying source through a sulfuric acid adjusting pipe and a hydrogen peroxide adjusting pipe, respectively; a principal outlet of said second mixing device leads to said acid scouring tank;
a thermometer and an oxygen concentration meter are arranged on both of the principal outlet of said first mixing device and the principal outlet of said second mixing device; a flow valve is arranged on each of said principal sulfuric acid pipe, said principal hydrogen peroxide pipe, said sulfuric acid adjusting pipe and said hydrogen peroxide adjusting pipe;
said third mixing device includes a mixing duct, a multi-section mixing screw rod arranged inside said mixing duct, a heater wrapped around said mixing duct and a cooling passage; a principal inlet of said third mixing device leads to the principal outlet of said second mixing device; the principal inlet of said third mixing device leads to said acid scouring tank; said cooling passage is provided with a coolant inlet and a coolant outlet, and said coolant inlet and said coolant outlet lead to an outlet end and an inlet end of said cooling circulation device through said cooling passage, respectively; and
said heater, said thermometer, said oxygen concentration meter, said cooling circulation device and said flow valve are electrically connected to said feedback-control panel; and a principal outlet of said third mixing device is also provided with a thermometer and an oxygen concentration meter that are electrically connected to said feedback-control panel.