US 12,334,365 B2
Exhaust piping for a semiconductor processing tool
Kuo-Sheng Lien, Hsinchu (TW); and Yung-Ho Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 31, 2021, as Appl. No. 17/446,580.
Prior Publication US 2023/0065093 A1, Mar. 2, 2023
Int. Cl. B08B 3/08 (2006.01); B08B 13/00 (2006.01); F26B 3/04 (2006.01); F26B 9/10 (2006.01); F26B 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67023 (2013.01) [B08B 3/08 (2013.01); B08B 13/00 (2013.01); F26B 3/04 (2013.01); F26B 9/10 (2013.01); F26B 21/004 (2013.01); H01L 21/67017 (2013.01); H01L 21/67028 (2013.01); H01L 21/6704 (2013.01); H01L 21/67057 (2013.01); H01L 21/67075 (2013.01); H01L 21/67086 (2013.01); H01L 21/67757 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor processing tool, comprising:
a processing tank;
an arm arranged to hold a plurality of wafers over the processing tank such that wafers in the plurality of wafers are horizontally stacked over the processing tank; and
a fan arranged over the arm to permit an airflow to be provided across surfaces of the wafers in a vertical direction toward the processing tank; and
an exhaust system including:
at least one exhaust output to direct exhaust air away from the semiconductor processing tool, and
one or more exhaust pipe segments arranged substantially around the processing tank and connected to the at least one exhaust output,
wherein the one or more exhaust pipe segments include a plurality of openings on a bottom end of the one or more exhaust pipe segments to receive the exhaust air to be provided to the at least one exhaust output.