US 12,334,362 B2
Package structure including photonic package having embedded optical glue
Jiun Yi Wu, Zhongli (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/150,557.
Claims priority of provisional application 63/405,965, filed on Sep. 13, 2022.
Claims priority of provisional application 63/365,136, filed on May 23, 2022.
Prior Publication US 2023/0377907 A1, Nov. 23, 2023
Int. Cl. H01L 21/56 (2006.01); G02B 6/12 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01)
CPC H01L 21/565 (2013.01) [G02B 6/12004 (2013.01); H01L 21/6835 (2013.01); H01L 23/5389 (2013.01); G02B 2006/12147 (2013.01); H01L 2221/68345 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package, the method comprising:
bonding a first wafer to a second wafer, wherein the first wafer comprises a plurality of electronic dies, and the second wafer comprises a plurality of photonic dies;
after bonding the first wafer, forming trenches in the second wafer between adjacent ones of the plurality of photonic dies;
filling the trenches with an optical glue; and
dicing the first wafer and the second wafer to form a plurality of photonic packages,
wherein a photonic package of the plurality of photonic packages comprises an electronic die, a photonic die bonded to the electronic die, and the optical glue, wherein the optical glue extends along a sidewall of the photonic package.