| CPC H01L 21/187 (2013.01) [H01L 21/02002 (2013.01); H01L 21/304 (2013.01); H01L 21/7806 (2013.01)] | 20 Claims |

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1. A detachable structure for transferring or handling layers, comprising:
at least two interfaces including an assembly interface and a favored-detachment interface;
a receiver substrate;
a donor substrate comprising a working layer to be transferred, the working layer disposed on an initial substrate;
the favored-detachment interface being situated between the working layer and the initial substrate, and the assembly interface being situated between the working layer and the receiver substrate;
wherein:
the assembly interface has an assembly-interruption zone comprising at least one cavity present in the receiver substrate or in the working layer, if in the working layer, the depth of the cavity being strictly less than a thickness of the working layer,
the assembly-interruption zone is located in a peripheral region of the detachable structure and does not extend along the entire perimeter of the detachable structure, the assembly-interruption zone allowing a stress field at a head of a wave front of a separation wave to be modified when this wave is initiated in the assembly interface to transfer or handle the working layer.
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