US 12,334,321 B1
And manufacturing methods of SWIR I2TUBE via heterogeneous wafer integration
Bed Pantha, Chandler, AZ (US)
Assigned to L3HARRIS TECHNOLOGIES, INC., Melbourne, FL (US)
Filed by L3Harris Technologies, Inc., Melbourne, FL (US)
Filed on Aug. 7, 2024, as Appl. No. 18/796,351.
Int. Cl. H01J 40/06 (2006.01); G02B 23/12 (2006.01); H01J 1/34 (2006.01); H01J 9/12 (2006.01); H01J 9/20 (2006.01)
CPC H01J 40/06 (2013.01) [G02B 23/12 (2013.01); H01J 1/34 (2013.01); H01J 9/12 (2013.01); H01J 9/205 (2013.01); H01J 2201/3423 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of forming a photocathode, the method comprising:
(a) assembling a first absorber on a first substrate for a first spectral band;
(b) assembling a second absorber on a second substrate for a second spectral band, wherein the second substrate is different from the first substrate, and wherein the second spectral band is different from the first spectral band; and
(c) joining the first absorber and the second absorber using a direct semiconductor wafer bonding process.