US 12,334,292 B2
Thin film coating packaging for device having meltable and wetting links
Yuriy Borisovich Matus, Pleasanton, CA (US); Martin G. Pineda, Fremont, CA (US); Boris Golubovic, Chicago, IL (US); and Deepak Nayar, Chicago, IL (US)
Assigned to Littelfuse, Inc., Chicago, IL (US)
Filed by Littelfuse, Inc., Chicago, IL (US)
Filed on Aug. 14, 2023, as Appl. No. 18/233,394.
Application 18/233,394 is a division of application No. 17/331,808, filed on May 27, 2021, granted, now 11,807,770.
Claims priority of provisional application 63/039,177, filed on Jun. 15, 2020.
Prior Publication US 2023/0383139 A1, Nov. 30, 2023
Int. Cl. H01H 85/046 (2006.01); H01H 85/143 (2006.01); H01H 85/38 (2006.01)
CPC H01H 85/143 (2013.01) [H01H 85/046 (2013.01); H01H 2085/383 (2013.01); H01H 2085/388 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A device comprising:
one or more electrodes;
a meltable link electrically joining the one or more electrodes; and
a thin-film coating covering the one or more electrodes and the meltable link;
wherein the thin-film coating is formed by depositing a slurry comprising a melt mixture of insoluble and soluble polymer and a solvent onto the device.