US 12,334,272 B2
Multilayer electronic component
Eun Cho, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 7, 2023, as Appl. No. 18/132,104.
Claims priority of application No. 10-2022-0176037 (KR), filed on Dec. 15, 2022.
Prior Publication US 2024/0203658 A1, Jun. 20, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
side margin portions respectively disposed on the fifth and sixth surfaces; and
external electrodes respectively disposed on the third and fourth surfaces,
wherein 0.436<RM/RA<0.920 and 1.75×10−4<RA<9.10×10−4 in which RA is an intensity ratio of Na relative to Ti included in the capacitance forming portion and RM is an intensity ratio of Na relative to Ti included in one of the side margin portions.