US 12,334,270 B2
Multilayer electronic component containing coating layers having an island region
Sung Min Cho, Suwon-si (KR); Jang Yeol Lee, Suwon-si (KR); and Ho Phil Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 19, 2022, as Appl. No. 17/969,176.
Claims priority of application No. 10-2021-0191395 (KR), filed on Dec. 29, 2021.
Prior Publication US 2023/0207213 A1, Jun. 29, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes;
external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and
coating layers respectively covering each of the plating layers and including an island region exposing a portion of a surface of the plating layer,
wherein 0.5 μm to 5 μm is a range of an average diameter of the island region.