US 12,334,269 B2
Multilayer electronic component
Yoona Park, Suwon-si (KR); Kangha Lee, Suwon-si (KR); Hye Young Choi, Suwon-si (KR); Dong Ha Kang, Suwon-si (KR); and Chul Seung Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 19, 2023, as Appl. No. 18/223,739.
Claims priority of application No. 10-2022-0111579 (KR), filed on Sep. 2, 2022.
Prior Publication US 2024/0079182 A1, Mar. 7, 2024
Int. Cl. H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, the body including a first corner connecting the third surface to the first, second, fifth, and sixth surfaces and a second corner connecting the fourth surface to the first, second, fifth, and sixth surfaces;
a first external electrode including a first base electrode layer disposed on the third surface, a first intermediate electrode layer disposed on the first corner and connected to the first base electrode layer, a first conductive resin layer disposed on the first intermediate electrode layer, and a first plating layer disposed on the first conductive resin layer; and
a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second corner and connected to the second base electrode layer, a second conductive resin layer disposed on the second intermediate electrode layer, and a second plating layer disposed on the second conductive resin layer,
wherein at least a portion of the first intermediate electrode layer is in contact with the first plating layer on the first corner, and at least a portion of the second intermediate electrode layer is in contact with the second plating layer on the second corner.