US 12,334,268 B2
Multilayer electronic component
Ji Hye Han, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); Hong Je Choi, Suwon-si (KR); Byung Woo Kang, Suwon-si (KR); Hye Jin Park, Suwon-si (KR); Sang Wook Lee, Suwon-si (KR); and Bon Seok Koo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 1, 2022, as Appl. No. 17/978,660.
Claims priority of application No. 10-2021-0182663 (KR), filed on Dec. 20, 2021.
Prior Publication US 2023/0197344 A1, Jun. 22, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween; and
external electrodes disposed outside the body,
wherein the external electrodes include:
a first electrode layer connected to the internal electrodes and including a first conductive metal;
a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including a first intermetallic compound and a first resin;
a second resin electrode layer disposed on the first resin electrode layer and including a plurality of second metal particles and a second resin; and
a second interfacial layer disposed between the first resin electrode layer and the second resin electrode layer and including a third intermetallic compound.