US 12,334,266 B2
Electronic component, electronic component manufacturing method, capacitor, and capacitor manufacturing method
Hiroki Takeoka, Nara (JP); Takayuki Hattori, Osaka (JP); and Yukihiro Shimasaki, Hyogo (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Feb. 24, 2023, as Appl. No. 18/174,598.
Application 18/174,598 is a continuation of application No. PCT/JP2021/032549, filed on Sep. 3, 2021.
Claims priority of application No. 2020-165742 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0223194 A1, Jul. 13, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/252 (2006.01); H01G 4/32 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/252 (2013.01); H01G 4/32 (2013.01)] 32 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an electronic component element including external electrodes at both ends of the electronic component element;
a barrier film covering at least a part of a periphery of the electronic component element; and
an outer packaging resin layer covering the electronic component element and the barrier film, wherein:
the barrier film includes an insulating film having electrical insulating property and a clay layer containing clay, and
only the clay layer in the barrier film contains the clay.