| CPC H01G 4/224 (2013.01) [H01G 4/08 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01)] | 11 Claims |

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1. An electronic component comprising:
a lower electrode provided on a main surface of a substrate;
a dielectric film that covers at least top and side surfaces of the lower electrode; and
an upper electrode stacked on the top surface of the lower electrode through the dielectric film,
wherein a part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly, and
wherein a part of the dielectric film that covers a corner part that is a terminal edge between the top and side surfaces of the lower electrode is removed at least partly.
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