US 12,334,254 B2
Coil component, circuit board, and electronic device
Daiki Mimura, Tokyo (JP); and Tetsuyuki Suzuki, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Oct. 16, 2023, as Appl. No. 18/487,576.
Application 18/487,576 is a continuation of application No. 17/032,807, filed on Sep. 25, 2020, granted, now 11,823,834.
Claims priority of application No. 2019-178051 (JP), filed on Sep. 27, 2019.
Prior Publication US 2024/0047110 A1, Feb. 8, 2024
Int. Cl. H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 27/255 (2006.01)
CPC H01F 5/003 (2013.01) [H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A coil component comprising:
a magnetic base body containing a plurality of metal magnetic particles and a binder containing a thermosetting resin;
an insulating plate; and
a coil conductor provided in the magnetic base body and including a winding portion wound around a coil axis, the coil conductor containing an upper coil element and a lower coil element, the upper coil element being provided on an upper surface of the insulating plate, the lower coil element being provided on a lower surface of the insulating plate,
wherein as viewed from a direction of the coil axis, the magnetic base body includes a core region enclosed by the winding portion, and wherein as viewed from the direction of the coil axis, a ratio of an area of the core region to a sum of an area of the winding portion and the area of the core region is within a range from 32% to 60%.