| CPC H01F 27/346 (2013.01) [H01F 41/041 (2013.01); H05K 1/165 (2013.01); H04B 1/525 (2013.01)] | 15 Claims |

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1. A substrate comprising:
at least one dielectric layer;
a plurality of interconnects comprising a first plurality of interconnects and a second plurality of interconnects; and
an inductive coupler formed in the at least one dielectric layer, the inductive coupler comprising:
a first inductor formed in the at least one dielectric layer,
wherein the first inductor is defined by at least the first plurality of interconnects,
wherein the first plurality of interconnects of the first inductor are configured to be electrically coupled to (i) a first terminal of a transmitter filter and (ii) an antenna; and
a second inductor formed in the at least one dielectric layer,
wherein the second inductor is defined by at least the second plurality of interconnects,
wherein the second plurality of interconnects of the second inductor are configured to be electrically coupled to (i) a second terminal of the transmitter filter and (ii) ground,
wherein the second plurality of interconnects of the second inductor are configured to provide a path to ground for a rejected signal having a rejected frequency, and
wherein the second inductor is located adjacent to the first inductor such that the rejected signal traveling through the second plurality of interconnects of the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmitter filter.
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