US 12,334,247 B2
Multi-layer coil component
Akihiko Oide, Tokyo (JP); Makoto Yoshino, Tokyo (JP); Tomoki Okada, Yurihonjo (JP); Hideki Saitou, Yurihonjo (JP); Seiji Osada, Yurihonjo (JP); Kazuhiro Ebina, Tokyo (JP); Kunio Oda, Tokyo (JP); Takashi Abe, Yurihonjo (JP); Akio Shibata, Tokyo (JP); and Kazuo Iwai, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Mar. 22, 2022, as Appl. No. 17/701,448.
Claims priority of application No. 2021-057711 (JP), filed on Mar. 30, 2021.
Prior Publication US 2022/0319766 A1, Oct. 6, 2022
Int. Cl. H01F 27/29 (2006.01); H01F 17/00 (2006.01)
CPC H01F 27/292 (2013.01) [H01F 17/0013 (2013.01); H01F 2017/002 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A multi-layer coil component comprising:
an element body including a plurality of layers stacked and having a pair of end surfaces facing each other in a first direction parallel to a stacking direction of the plurality of layers and a side surface connecting the pair of end surfaces;
a coil provided in the element body and having a coil axis parallel to the first direction; and,
a pair of external electrodes respectively provided on the end surfaces of the element body,
wherein the coil having:
a plurality of coil layers provided between the plurality of layers constituting the element body and arranged along the first direction; and,
a plurality of via conductors provided between the coil layers adjacent to each other in the first direction and electrically connecting the adjacent coil layers to each other,
wherein, when viewed from the first direction, the via conductor protrudes from a coil region where the coil layer is formed toward the side surface of the element body.