US 12,334,246 B2
Electronic component and method of manufacturing the same
Hirotaka Wakabayashi, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Sep. 13, 2021, as Appl. No. 17/473,351.
Claims priority of application No. 2020-166434 (JP), filed on Sep. 30, 2020.
Prior Publication US 2022/0102062 A1, Mar. 31, 2022
Int. Cl. H01F 27/29 (2006.01); H01F 27/255 (2006.01); H01F 41/04 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 27/255 (2013.01); H01F 41/04 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an insulating base body;
an external electrode provided on the base body and including a metal portion, glass, and metal oxide, the metal portion being made of a metal material and having electric conductivity, the metal oxide being electrically non-conductive; and
a functional part made of a metal and electrically connected to the external electrode,
wherein the external electrode includes a glass aggregation region made of an aggregation of the glass,
wherein the glass aggregation region surrounds the metal oxide, and
wherein the glass aggregation region is disposed apart from the insulating base body.