US 12,334,244 B2
Electronic component
Hirotaka Wakabayashi, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Nov. 6, 2023, as Appl. No. 18/502,766.
Application 18/502,766 is a continuation of application No. 17/127,184, filed on Dec. 18, 2020, granted, now 11,848,144.
Claims priority of application No. 2019-238929 (JP), filed on Dec. 27, 2019.
Prior Publication US 2024/0079175 A1, Mar. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 1/33 (2006.01); H01F 27/32 (2006.01); H05K 1/16 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 1/33 (2013.01); H01F 27/32 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a base body;
a conductor provided inside or outside the base body, the conductor being mainly formed of Cu;
a first external electrode electrically connected to the conductor;
a second external electrode electrically connected to the conductor; and
a metal film positioned between the conductor and the first external electrode, the metal film being mainly formed of Ag,
wherein the metal film contains metal particles configured such that an average of β/α is 0.8 to 1.2, where for each of the metal particles, α is a dimension of the metal particle in a direction horizontal to a boundary interface between the conductor and the metal film, and β is a dimension of the metal particle in a direction perpendicular to the boundary interface.