US 12,334,232 B2
External cooling solution for mobile computing devices
Navneet Kumar Singh, Bangalore (IN); Samarth ALva, Bangalore (IN); Raghavendra S. Kanivihalli, Bangalore (IN); Aiswarya M. Pious, Bangalore (IN); Samantha Rao, Bangalore (IN); and Bijendra Singh, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 20, 2021, as Appl. No. 17/380,656.
Prior Publication US 2021/0350952 A1, Nov. 11, 2021
Int. Cl. H05K 7/20 (2006.01); G05B 15/02 (2006.01); G06F 1/20 (2006.01); H01B 7/42 (2006.01); H01B 11/00 (2006.01)
CPC H01B 7/421 (2013.01) [G05B 15/02 (2013.01); G06F 1/203 (2013.01); H05K 7/20136 (2013.01); H05K 7/20209 (2013.01); H01B 11/00 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a cable comprising a plurality of wires, the cable having a first end and a second end;
one or more cooling channels external to the cable;
an air mover connected to the one or more cooling channels, the air mover to generate forced air and provide the forced air to the cooling channels;
wherein the air mover is positioned at a point along the cable between the first end of the cable and the second end of the cable; and
a connector located at the first end of the cable to connect the wires and the cooling channels to a mobile computing device.