US 12,334,138 B2
Dynamic address scramble
Erik T. Barmon, Boise, ID (US); Yang Lu, Boise, ID (US); Nathaniel J. Meier, Boise, ID (US); and Kang-Yong Kim, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 30, 2022, as Appl. No. 17/823,450.
Prior Publication US 2024/0071464 A1, Feb. 29, 2024
Int. Cl. G11C 11/408 (2006.01); G06F 12/06 (2006.01); G11C 7/24 (2006.01); G11C 29/18 (2006.01); G11C 29/56 (2006.01)
CPC G11C 11/408 (2013.01) [G06F 12/06 (2013.01); G11C 7/24 (2013.01); G11C 29/18 (2013.01); G11C 29/56004 (2013.01)] 42 Claims
OG exemplary drawing
 
1. A method comprising:
monitoring, by a memory controller coupled to a memory device comprising a plurality of memory dies, a timer from a previous configuration of address scramble patterns of the memory device;
migrating data from the memory device to another memory device in response to the timer reaching a threshold that enables the memory controller to change the address scramble patterns of the memory device;
determining, by the memory controller, that the address scramble patterns of the memory device are in a configurable state after the data has been migrated from the memory device to the other memory device;
selecting, from a plurality of address scramble patterns implemented by the memory controller, a first address scramble pattern for a first memory die of the plurality of memory dies, the first address scramble pattern providing a first logical-to-physical mapping for row addresses of the first memory die of the memory device;
selecting, from the plurality of address scramble patterns implemented by the memory controller, a second address scramble pattern for a second memory die of the plurality of memory dies, the second address scramble pattern providing a second logical-to-physical mapping for row addresses of the second memory die of the memory device that is different from the first logical-to-physical mapping for row addresses of the first memory die of the memory device;
configuring, by the memory controller, the first memory die of the memory device to use the first address scramble pattern for logical-to-physical mapping of the row addresses associated with access of the first memory die of the memory device; and
configuring, by the memory controller, the second memory die of the memory device to use the second address scramble pattern for logical-to-physical mapping of the row addresses associated with access of the second memory die of the memory device.