US 12,334,121 B2
Disk device suspension assembly with microactuator grounding configuration
Yasuo Suzuki, Fujisawa Kanagawa (JP); and Takuma Kido, Tokyo (JP)
Assigned to KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed by Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed on Mar. 2, 2023, as Appl. No. 18/116,642.
Claims priority of application No. 2022-148080 (JP), filed on Sep. 16, 2022.
Prior Publication US 2024/0096379 A1, Mar. 21, 2024
Int. Cl. G11B 33/14 (2006.01); G11B 5/48 (2006.01)
CPC G11B 33/1493 (2013.01) [G11B 5/483 (2015.09); G11B 5/484 (2013.01); G11B 5/4846 (2013.01); G11B 5/4853 (2013.01); G11B 5/486 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A flexure for use in a suspension assembly, the flexure comprising:
a metal plate; and
a wiring substrate connected to the metal plate, the wiring substrate comprising:
an insulating layer abutting the metal plate,
a conductive layer disposed on the insulating layer, the conductive layer comprising a ground pad,
a piezoelectric element, the piezoelectric element comprising a ground electrode, and
a first end comprising a plurality of connecting terminals;
wherein the ground electrode is connected to the ground pad, wherein one of the plurality of connecting terminals is a ground terminal, wherein the conductive layer further comprises a ground trace that connects the ground terminal and the ground pad, and wherein the piezoelectric element and the ground trace are electrically isolated from the metal plate by the insulating layer configured not to allow an additional electrical connection between the ground electrode and the ground terminal, reducing an occurrence of static electricity on the piezoelectric element.