US 12,333,369 B2
Circuit module and RFID tag
Yoshihiro Aoyama, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 1, 2022, as Appl. No. 17/901,324.
Application 17/901,324 is a continuation of application No. PCT/JP2020/036709, filed on Sep. 28, 2020.
Claims priority of application No. 2020-052512 (JP), filed on Mar. 24, 2020.
Prior Publication US 2022/0414415 A1, Dec. 29, 2022
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07752 (2013.01) 16 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a substrate including a first surface and a second surface that oppose each other;
an integrated circuit (IC) disposed on the first surface of the substrate;
a circuit disposed on the first surface and the second surface of the substrate and having a conductor pattern obtained by heat curing of a conductive paste;
a dummy conductor pattern obtained by heat curing of the conductive paste; and
a terminal electrode that overlaps the dummy conductor pattern in a plan view of the first surface of the substrate,
wherein the dummy conductor pattern is independent of and not in contact with the conductor pattern, and
wherein the dummy conductor pattern is disposed on at least one of the first surface and the second surface of the substrate and is configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.