US 12,333,360 B2
RFID system suitable for being attached to fabrics and method for the digitalization of fabrics
Davide Zanesi, Lecco (IT)
Assigned to ME Innovation SRL, Manocalzati (IT)
Filed by ME Innovation SRL, Manocalzati (IT)
Filed on May 4, 2023, as Appl. No. 18/143,096.
Application 18/143,096 is a division of application No. 16/493,762, filed on Sep. 13, 2019, granted, now 11,663,434.
Prior Publication US 2023/0359848 A1, Nov. 9, 2023
Int. Cl. G06K 19/02 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/027 (2013.01) [B32B 37/06 (2013.01); B32B 37/1207 (2013.01); B32B 38/0004 (2013.01); G06K 19/025 (2013.01); G06K 19/0723 (2013.01); G06K 19/07728 (2013.01); G06K 19/07762 (2013.01); G06K 19/07786 (2013.01); B32B 2519/02 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for digitalization of fabrics and for realization of RFID systems for fabrics comprising:
sizing of fabric or processing from a roll of fabric;
pre-forming of a base dielectric layer in thermoadhesive or thermoplastic polyurethanes (TPU) with one of a die, or laser cutting or mechanical cutting, realization with a defined shape, Surface of die basis<Surface of die closure;
hot application of the TPU layer with hot heat press for about 15 seconds at about 55° C.,
application of the TPU layer with ultrasound system to lower an overall operating temperature and operating times for about 4 seconds at Tamb;
pre-forming of an aluminum or conductive foil by one of die cutting, laser cutting or mechanical cutting;
positioning of the foil, centering on the TPU layer with a numerical control system, or pick&place system;
additionally passage with heat press at about 150° C. for about 1-2 seconds to adhere the foil with the TPU, in a bonding phase providing a glue point to fix a module to the foil with a dedicated machine for bonding and fixing by gluing;
positioning a rigid electronic module using pick&place;
pre-forming of a second closing TPU dielectric layer, that is a cover layer, using die cutting, laser cutting or mechanical cutting;
positioning and heat-sealing of the second closing TPU dielectric layer at about 155° C. for about 15 seconds;
assembling the RFID system by stitching, forming a side of the second closing TPU dielectric layer in TPU, the fabric being adapted to be printed with one of a logo, the fabric being realized with a fabric edge in excess of an area of creation of an electronic device to allow a subsequent sewing on a garment or another textile support.